1. general description the IP4790CZ38 is a single chip electrostatic discharge (esd) protection solution for the displayport interfaces. the low capacitance, typically 0.7 pf to ground, supports the high data rates de?ned by the displayport interface standard. 2. features n robust esd protection does not degrade even after several discharge incidents n low leakage, even after several hundred esds n very high ns diode switching speed and low line capacitance (0.7 pf to ground and 0.05 pf between channels) ensures signal integrity n integrated rail-to-rail clamping diodes with downstream esd protection of 8kv according to iec 61000-4-2, level 4 on all main link (ml) signal lines n matched 0.5 mm trace spacing n optimized tssop 38-pin package: u highly integrated u small footprint u pcb-level u rf-routing u lead (pb) free n complies with directive 2002/95/ec, restriction of hazardous substances (rohs) 3. applications the IP4790CZ38 can be used with a range of displayport devices including: n personal computer n pc monitor n notebook 4. ordering information IP4790CZ38 displayport protection rev. 01 14 july 2008 product data sheet table 1. ordering information type number package name description version IP4790CZ38 tssop38 plastic thin shrink small outline package; 38 leads; body width 4.4 mm; lead pitch 0.5 mm sot510-1
IP4790CZ38_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 14 july 2008 2 of 11 nxp semiconductors IP4790CZ38 displayport protection 5. functional diagram 6. pinning information 6.1 pinning fig 1. functional diagram 001aai165 ml_0a ml_1a ml_2a ml_3a vbias bias_cap gnd gnd gnd gnd ml_1b ml_0b hot_plug bias_cap ml_2b ml_3b aux_a bias_cap aux_b bias_cap fig 2. pin con?guration sot510-1 (tssop38) IP4790CZ38 vbias bias_cap gnd gnd ml_0a n.c. n.c. ml_0b gnd gnd ml_1a n.c. n.c. ml_1b gnd gnd ml_2a n.c. n.c. ml_2b gnd gnd ml_3a n.c. n.c. ml_3b gnd gnd n.c. n.c. n.c. n.c. n.c. aux_a n.c. aux_b n.c. hot_plug 001aai164 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20
IP4790CZ38_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 14 july 2008 3 of 11 nxp semiconductors IP4790CZ38 displayport protection 6.2 pin description table 2. pin description symbol pin description vbias 1 bias voltage gnd 2 ground ml_0a 3 main link 0a lane protection n.c. 4 not connected gnd 5 ground ml_1a 6 main link 1a lane protection n.c. 7 not connected gnd 8 ground ml_2a 9 main link 2a lane protection n.c. 10 not connected gnd 11 ground ml_3a 12 main link 3a lane protection n.c. 13 not connected gnd 14 ground n.c. 15, 16, 17, 18, 19 not connected hot_plug 20 hot plug signal protection aux_b 21 auxiliary channel b protection aux_a 22 auxiliary channel a protection n.c. 23, 24 not connected gnd 25 ground ml_3b 26 main link 3b lane protection n.c. 27 not connected gnd 28 ground ml_2b 29 main link 2b lane protection n.c. 30 not connected gnd 31 ground ml_1b 32 main link 1b lane protection n.c. 33 not connected gnd 34 ground ml_0b 35 main link 0b lane protection n.c. 36 not connected gnd 37 ground bias_cap 38 capacitor bias (optional)
IP4790CZ38_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 14 july 2008 4 of 11 nxp semiconductors IP4790CZ38 displayport protection 7. limiting values [1] human body model (hbm) according iec 61000-4-2, level 4. [2] where x = 0, 1, 2 and 3. 8. characteristics [1] where x = 0, 1, 2 and 3. [2] this parameter is guaranteed by design and veri?ed by device characterization. [3] according to iec 61000-4-5/9. [4] human body model (hbm) according iec 61000-4-2, level 4. table 3. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v esd electrostatic discharge voltage signal pins to ground: ml_xa, ml_xb, aux_a, aux_b and hot_plug [1] [2] - 8kv v vbias voltage on pin vbias gnd - 0.5 5.5 v t stg storage temperature - 55 +125 c p tot total power dissipation - 0 mw table 4. characteristics t amb = 25 c; unless otherwise indicated. symbol parameter conditions min typ max unit v brzd zener diode breakdown voltage measured with i=1ma 6 - 9 v v fd diode forward voltage - 0.7 - v pins ml_xa, ml_xb [1] i bck back current from pins ml_xa and ml_xb to bias; at power-down; v vbias IP4790CZ38_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 14 july 2008 5 of 11 nxp semiconductors IP4790CZ38 displayport protection 9. application information the IP4790CZ38 simpli?es the protection of an displayport interface. connecting an optional 100 nf capacitor to the bias_cap pin (lead 38) enhances the esd protection clamping performance. the vbias pin reduces the capacitive load of the esd protection and v vbias can be in the range 2.5 v to 5.5 v. fig 3. typical application 001aai175 IP4790CZ38 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 vbias displayport 1 ml_lane 0(p)/3(n) gnd ml_lane 0(n)/3(p) ml_lane 1(p)/2(n) gnd ml_lane 1(n)/2(p) ml_lane 2(p)/1(n) gnd ml_lane 2(n)/1(p) ml_lane 3(p)/0(n) gnd ml_lane 3(n)/0(p) gnd gnd aux_ch(p) gnd aux_ch(n) hot plug detect return dp_pwr dp_pwr
IP4790CZ38_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 14 july 2008 6 of 11 nxp semiconductors IP4790CZ38 displayport protection 10. package outline fig 4. package outline sot510-1 (tssop38) unit a 1 a 2 a 3 b p cd (1) e (2) eh e ll p z (1) y w v q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 8 0 o o 0.08 dimensions (mm are the original dimensions). notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. sot510-1 03-02-18 05-11-02 w m q a a 1 a 2 d l p detail x e z e c l x (a ) 3 0.25 1 19 38 20 y b h 0.95 0.85 0.27 0.17 0.20 0.09 9.8 9.6 4.5 4.3 0.5 1 0.2 6.4 0.49 0.21 0.08 0.7 0.5 p e v m a a tssop38: plastic thin shrink small outline package; 38 leads; body width 4.4 mm; lead pitch 0.5 mm sot510-1 a max. 1.1 0 2.5 5 mm scale pin 1 index mo-153
IP4790CZ38_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 14 july 2008 7 of 11 nxp semiconductors IP4790CZ38 displayport protection 11. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 surface mount re?ow soldering description . 11.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electrical circuits. the soldered joint provides both the mechanical and the electrical connection. there is no single soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for ?ne pitch smds. re?ow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 11.2 wave and re?ow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. the re?ow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature pro?le. leaded packages, packages with solder balls, and leadless packages are all re?ow solderable. key characteristics in both wave and re?ow soldering are: ? board speci?cations, including the board ?nish, solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivity level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 11.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhesive and ?ux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath speci?cations, including temperature and impurities
IP4790CZ38_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 14 july 2008 8 of 11 nxp semiconductors IP4790CZ38 displayport protection 11.4 re?ow soldering key characteristics in re?ow soldering are: ? lead-free versus snpb soldering; note that a lead-free re?ow process usually leads to higher minimum peak temperatures (see figure 5 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? re?ow temperature pro?le; this pro?le includes preheat, re?ow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classi?ed in accordance with t ab le 5 and 6 moisture sensitivity precautions, as indicated on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during re?ow soldering, see figure 5 . table 5. snpb eutectic process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 3 350 < 2.5 235 220 3 2.5 220 220 table 6. lead-free process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
IP4790CZ38_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 14 july 2008 9 of 11 nxp semiconductors IP4790CZ38 displayport protection for further information on temperature pro?les, refer to application note an10365 surface mount re?ow soldering description . 12. revision history msl: moisture sensitivity level fig 5. temperature pro?les for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 7. revision history document id release date data sheet status change notice supersedes IP4790CZ38_1 20080714 product data sheet - -
IP4790CZ38_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 14 july 2008 10 of 11 nxp semiconductors IP4790CZ38 displayport protection 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 13.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 13.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 13.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 14. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors IP4790CZ38 displayport protection ? nxp b.v. 2008. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 14 july 2008 document identifier: IP4790CZ38_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 15. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 application information. . . . . . . . . . . . . . . . . . . 5 10 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 soldering of smd packages . . . . . . . . . . . . . . . 7 11.1 introduction to soldering . . . . . . . . . . . . . . . . . . 7 11.2 wave and re?ow soldering . . . . . . . . . . . . . . . . 7 11.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . . 7 11.4 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . . 8 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 legal information. . . . . . . . . . . . . . . . . . . . . . . 10 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 13.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 14 contact information. . . . . . . . . . . . . . . . . . . . . 10 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
|
